4. sercos international Newsletter

The webletter for Real-Time-Ethernet-Communication with sercos III
 
sercos Seminars in Boeblingen

Similar to last year, two seminars will be held during the Automatisierungstreff in the Kongresshalle of Böblingen: the „sercos for Automation“ user seminar and the sercos III developer seminar. The seminars impart both theoretical and practical information.
 
Experts from science and industry will give an overview of the functions andnnew features of the Ethernet-based sercos III and describe the migration from the traditional sercos. The profile of devices for decentralized I/Os (sercos IO) and the “CIP Safety on sercos” safety concept will also be presented.  The fundamental lectures will be completed with presentations of components, products and system solutions based on sercos III.
 
The participants will receive a coupon for visiting the Automatisierungstreff  where sercos International and well-known manufacturers are exhibiting the newest sercos III products at the sercos booth.
 
Dates:
 
18th of March 2009:      User seminar "sercos for Automation"
19th of March 2009:      Developer seminar sercos III
 
An announcement and information on other seminars can be found on www.sercos.de
 

Call for Papers

Please take the opportunity to publish an article on your products and applications with sercos III in our sercos News magazine or in the sercos Newsletter in both German and English.
 
The articles must be sent in both German and English.
 

sercos Seminar in France

sercos International is offering a seminar in France on April 1, 2009. The subject will be the application of the sercos III real-time communication-system.  The user organization will be supported by leading technology companies which have their own representative presentations.
 
The participants will be informed of fundamental technical innovations of the Ethernet-based sercos III and receive an overview of relevant subjects, such as safety, configuration and I/O. The industry experts will report about their products and the newest implementations of sercos.
 
Date:
 
01.04.2009: Archamps/Annecy, France
 
An announcement and additional dates can be found at www.sercos.de
 

Looking back on SPS/IPC/DRIVES 2008

sercos International was represented with a new booth concept showing the newest devices and applications of the sercos III real-time communication standard.  Manufacturers of sercos III hardware presented their newest products in operating exhibits and multi-vendor demonstrations. The packaging experts at ROVEMA demonstrated a complex packaging application which is entirely realized with sercos III. Other subjects were sercos safety, interoperability, and the integration of I/Os into automation systems.
 
The newest activities and products were presented at a press conference.
 

Cooperation with the FDT Group

The user organisations for the two open standards sercos III and FDT have agreed to collaborate on drawing up an annex to the FDT specification for sercos III. sercos III will thus be the first high-performance real-time Ethernet communication standard to support FDT Technology, used by many manufacturers to connect field devices to a wide range of software environments. The extension of the FDT specification reinforces the flexibility of sercos III as a universal bus for real-time systems in the field of automation.
 

OMAC PackProfile for sercos III

The sercos vendor organizations have announced the development of a PackProfile for real-time Ethernet-based sercos III. The PackProfile defines a subset of the sercos interface functions for packaging machinery to ease implementation of the standard and improve the multi-vendor interoperability of servo controls and drives.  Products from various vendors that conform to the PackProfile will provide plug-and-play functionality for packaging machinery.
 

sercos international at Hannover Messe 2009

Numerous members of sercos International are participating in a joint booth at the Hannover Messe (April 20 – 24, 2009), presenting their sercos products and components in an 80 square meter booth, D23 in Hall 9.
On April 21, a press conference and the annual members meeting including the elections of the board will take place.